[209+ Pages Report] According to Facts and Factors, the global thermal interface materials market was registered at around USD 2.8 Billion in 2020 and is expected to generate approximately USD 5.1 Billion in revenue by the end of 2026, with a CAGR of approximately 10.4% between 2021 and 2026.
Thermal interface materials are materials that are used to disperse heat from electronic devices and enhance heat transmission. They are usually sandwiched between the dissipating device or heat-spreading substrate and the components or heat-generating chip. Thermal Interface Materials represent significant difficulties for materials research due to the numerous conceivable applications and a vast range of materials. Thermal management in the electronics industry is highly complicated and necessitates a thorough understanding of the material characteristics of the TIMs used.
Report Attributes |
Details |
Market Size in 2020 |
USD 2.8 Billion |
Projected Market Size in 2026 |
USD 5.1 Billion |
Growth Rate |
CAGR 10.4% |
Base Year |
2020 |
Forecast Years |
2021 – 2026 |
Key Market Players |
The 3M Company, Parker Hannifin Corporation, Laird Technologies, Indium Corporation, Zalma Tech Co. Ltd., Schlegel Electronic Materials, Inc., Universal Science, Master Bond Inc., Electrolube Limited, Fuji Polymer Industries Co., Ltd., AIM Specialty Materials, DK Thermal, GrafTech International Ltd., AOS Thermal Compounds LLC, Shin-Etsu Chemical Co. Ltd., Semikron, RBC Industries, Inc., LORD Corporation, Aremco Products Inc., Timtronics, Wakefield-Vette, Inc., Momentive Performance Materials, Dow Corning Corporation, Henkel AG & Co. KGaA, and Honeywell International Inc. amongst others. |
Key Segment |
By Type, By Product Type, By Application, By Region |
Major Regions Covered |
North America, Europe, Asia Pacific, Latin America, and the Middle East & Africa |
Purchase Options |
Request customized purchase options to meet your research needs. Explore purchase options |
The commercial availability of a variety of thermal interface materials in a variety of forms, along with expanding uses in the electronic sector, is expected to boost penetration in the coming years. Thermal interface materials are used to conduct heat across two hard surfaces and are particularly useful when sophisticated electrical gadgets are in high demand. Thermal interfaces are well-known for providing effective heat management solutions, which are necessary for enhancing the overall performance and longevity of a system.
Because of its thermal conductivity, the product is expected to see considerable gains, which will assist to extend the life and efficiency of the electronic device or equipment where it is used. Conductive materials, such as metals, metal oxides, or silicone, are commonly used to create the product.
Consumer behavior for electronic gadgets such as cell phones, tablets, and video games has not been affected by the post-pandemic situation. Rather, in recent years, under the recession, consumer durables sales have been falling as well. Furthermore, due to an increasing need for pharmaceuticals and medical equipment, demand for pharmaceutical and medical gear, as well as lab equipment has grown.
The global thermal interface materials market is segregated based on type, product type, application, and region. Based on type the market is bifurcated into polyimide, epoxy, silicone, and others. The silicone segment dominated in 2020 and is expected to continue its dominance in the forecast period. This can be attributed to its outstanding characteristics such as resistance to chemical attack, stability to mechanical stress, shock & vibration resistance, and temperature variation stability. Based on the product type the market is bifurcated into tapes & films, metal-based TIMs, greases & adhesives, phase change materials, gap fillers, and others. The greases & adhesives category dominated the product type segmentation in 2020 and is expected to dominate the segment in the upcoming years. This can be attributed to its growing use in several applications such as power conversion equipment, transmission & engine control modules, PCs, memory modules, server CPUs, and mobile phones among others. Based on application the market is divided into telecom, medical devices, automotive electronics, computers, consumer durables, industrial machinery, and others. The computers category dominated the application segmentation in 2020 and is expected to dominate the segment in the upcoming years. This can be attributed to the growing use of TIMs in GPUs and CPSs of computers.
Asia Pacific region dominated the market in 2020 with a market share of more than 35% and is anticipated to continue its dominance in the upcoming years. This is due to the existence of a big manufacturing zone in the area. Government policies, GST reductions, corporate tax reductions, changing lifestyles, consumer health awareness, and growing family incomes, in addition to the industrial base, have the potential to accelerate industry growth in this region. As more trucks and vans are utilized to deliver essentials across the area, sales in the automotive sector can only be achieved through vehicle refurbishing or repair. However, the government's continued focus on healthcare and the automotive sector, as well as its encouragement of FDI from Asian manufacturers, might help the business recover in the projected term. Despite Europe being a key market for the automobile sector and medical device production, the product is expected to lose income over time. This is owing to the fact that, as a result of the current pandemic epidemic, manufacturing operations have come to a halt due to a collapsed supply and demand for cars.
Some main participants of the global thermal interface materials market are
Copyright © 2023 - 2024, All Rights Reserved, Facts and Factors