Global System In Package (SiP) Technology Market Size, Share

Industry Insights

The report covers a forecast and an analysis of the system in package (SiP) technology market on a global and regional level. The study provides historical data from 2013 to 2018 and a forecast from 2019 to 2027 based on revenue (USD Million). The study includes drivers and restraints of the system in package (SiP) technology market along with their impact on the demand over the forecast period. Additionally, the report includes the study of opportunities available in the system in package (SiP) technology market on a global level.

In order to give the users of this report a comprehensive view of the system in package (SiP) technology market, we have included a competitive landscape and an analysis of Porter’s Five Forces model for the market. The study encompasses a market attractiveness analysis, wherein all the segments are benchmarked based on their market size, growth rate, and general attractiveness.

The report provides company market share analysis to give a broader overview of the key market players. In addition, the report also covers key strategic developments of the market including acquisitions & mergers, new launches, agreements, partnerships, collaborations & joint ventures, research & development, and regional expansion of major participants involved in the market on a global and regional basis.

The study provides a decisive view of the system in package (SiP) technology market by segmenting it based on interconnection technology, packaging technology, application, and region. All the segments have been analyzed based on present and future trends and the market is estimated from 2019 to 2027. The regional segment includes the current and forecast demand for North America, Europe, Asia Pacific, Latin America, and the Middle East and Africa.

The most significant growth factor driving the system in package (SiP) technology market is the flourishing portable electronics market due to the rising high-speed, compact-sized electronic products demand. Additionally, reduction of module size and enhanced thermal and electrical performance are major requirements of a wide range of portable electronic products, including digital cameras, smartphones, camcorders, wearable electronics, laptops, and tablets, and household electronics. Furthermore, IoT is gaining market popularity in SiP and may emerge as the third technological wave. Thus, the growing demand for small or miniaturized electronics along with high performance will serve as the key driver.

By interconnection technology, the market is categorized into flip chip and wire bond. Based on packaging technology, the market comprises 3-D IC, 2.5-D IC, and 2-D IC. The application segment includes industrial system, automotive, telecommunication, aerospace and defense, consumer electronics, and others.

Key players operating in the system in package (SiP) technology market are ASE Group, Chipmos Technologies, Powertech Technology, Jiangsu Changjiang Electronics, Renesas Electronics, Amkor, Fujitsu, Samsung, and Toshiba, among others.