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Global System In Package (SiP) Technology Market Revenue Is Projected Around USD 41,854 Million By 2027

17-Jan-2020 | Facts and Factors

Facts and Factors Market Research has published a new report titled “System In Package (SiP) Technology Market By Interconnection Technology (Flip Chip and Wire Bond), By Packaging Technology (2-D IC, 2.5-D IC, and 3-D IC), and By Application (Consumer Electronics, Automotive, Telecommunication, Industrial System, Aerospace & Defense, and Others): Global Industry Perspective, Comprehensive Analysis, and Forecast, 2018–2027”. According to the report, the global system in package (SiP) technology market was valued approximately USD 20,408 million in 2018 and is expected to reach a value of around USD 41,854 million by 2027, at a CAGR of around 8.1% between 2019 and 2027.

The growing demand for higher levels of integration and lower costs alongside the semiconductor industry and the rising awareness regarding complete system configuration are driving the popularity of System in Package (SiP) solutions across the world. SiP technology allows combining multiple advanced packaging technologies to create customized solutions for each and every application. Laminate-based SiP technology is among the front-runner solutions, and most popular SiP solution, for IoT, cellular, automotive, power, computing, and networking system integrations. SiP is characterized by more than combination of one active electronic component of different functionalities plus optionally passives and other devices, such as MEMS or optical components that are preferably assembled into a standard package, which provides multiple functions related to a sub-system or system.

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Browse the full “System In Package (SiP) Technology Market By Interconnection Technology (Flip Chip and Wire Bond), By Packaging Technology (2-D IC, 2.5-D IC, and 3-D IC), and By Application (Consumer Electronics, Automotive, Telecommunication, Industrial System, Aerospace & Defense, and Others): Global Industry Perspective, Comprehensive Analysis, and Forecast, 2018–2027” Report at https://www.fnfresearch.com/system-in-package-sip-technology-market-by-interconnection-171

Rising product use in processors and graphic cards majorly driving the system in package (SiP) technology market

SiP technology has rapidly penetrated the majority of the market segments across various sectors, such as consumer electronics, automotive, networking, medical electronics, computing, mobile, communication, etc. This rapid adoption is due to SiP’s several benefits like fewer power requirements and low cost, especially in mobile applications. SiP is extensively used in processors and graphic cards to provide better output of videos and games. This, in turn, is the major factor fuelling the system in package (SiP) technology market. The key market players are heavily investing in R&D of these packaging technologies to sustain the intense market competition.

The 2.5-D IC segment is projected to hold a major share in the packaging technology segment

The 2.5-D IC segment held the largest share in the system in package (SiP) technology market in the year 2018. This segment is projected to register a notable CAGR of 8.4% over the estimated timeframe, owing to the increasing paring of 2.5-D ICs with high-bandwidth memory modules, for the sole purpose of improving performance.

Flip chips are likely to lead the application segment in the future

The flip-chip students segment held around 67.8% of the global system in package (SiP) technology market in 2018. This segment is estimated to register a notable CAGR in the future, due to the rising integrated chips demand by the flourishing consumer electronics sector.

North America leads the global system in package (SiP) technology market

In 2018, the North American system in package (SiP) technology market was valued at USD 4,411 million. North America is likely to show significant growth in the system in package (SiP) technology market in the years ahead, due to the intense technological penetration, regional presence of major market players, and rising preference of consumer for technically-advanced interface software devices.

Key players operating in the system in package (SiP) technology market are ASE Group, Chipmos Technologies, Powertech Technology, Jiangsu Changjiang Electronics, Renesas Electronics, Amkor, Fujitsu, Samsung, and Toshiba, among others.

This report segments the system in package (SiP) technology market into:

Global System In Package (SiP) Technology Market: By Interconnection Technology

  • Flip Chip
  • Wire Bond

Global System In Package (SiP) Technology Market: By Packaging Technology

  • 2-D IC
  • 2.5-D IC
  • 3-D IC

Global System In Package (SiP) Technology Market: By Application

  • Consumer Electronics
  • Automotive
  • Telecommunication
  • Aerospace and Defense
  • Industrial System
  • Others

Global System In Package (SiP) Technology Market: By Region

  • North America
    • U.S.
  • Europe
    • UK
    • France
    • Germany
  • Asia Pacific
    • China
    • Japan
    • India
  • Latin America
    • Brazil
  • Middle East and Africa

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