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Thermal Interface Materials Market Size, Share Global Analysis Report, 2021 – 2026

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Thermal Interface Materials Market by Type (Silicone, Epoxy, Polyimide, and Others), By Product Type (Greases & Adhesives, Tapes & Films, Gap Fillers, Metal-Based TIMs, Phase Change Materials, and Others), By Application (Computers, Telecom, Consumer Durables, Medical Devices, Industrial Machinery, Automotive Electronics, and Others), By Region: Global & Regional Industry Perspective, Comprehensive Analysis, and Forecast 2021 – 2026

Industry Insights

[209+ Pages Report] According to Facts and Factors, the global thermal interface materials market was registered at around USD 2.8 Billion in 2020 and is expected to generate approximately USD 5.1 Billion in revenue by the end of 2026, with a CAGR of approximately 10.4% between 2021 and 2026.

logoMarket Overview 

Thermal interface materials are materials that are used to disperse heat from electronic devices and enhance heat transmission. They are usually sandwiched between the dissipating device or heat-spreading substrate and the components or heat-generating chip. Thermal Interface Materials represent significant difficulties for materials research due to the numerous conceivable applications and a vast range of materials. Thermal management in the electronics industry is highly complicated and necessitates a thorough understanding of the material characteristics of the TIMs used.

logoReport Scope

Report Attributes

Details

Market Size in 2020

USD 2.8 Billion

Projected Market Size in 2026

USD 5.1 Billion

Growth Rate

CAGR 10.4%

Base Year

2020

Forecast Years

2021 – 2026

Key Market Players

The 3M Company, Parker Hannifin Corporation, Laird Technologies, Indium Corporation, Zalma Tech Co. Ltd., Schlegel Electronic Materials, Inc., Universal Science, Master Bond Inc., Electrolube Limited, Fuji Polymer Industries Co., Ltd., AIM Specialty Materials, DK Thermal, GrafTech International Ltd., AOS Thermal Compounds LLC, Shin-Etsu Chemical Co. Ltd., Semikron, RBC Industries, Inc., LORD Corporation, Aremco Products Inc., Timtronics, Wakefield-Vette, Inc., Momentive Performance Materials, Dow Corning Corporation, Henkel AG & Co. KGaA, and Honeywell International Inc. amongst others.

Key Segment

By Type, By Product Type, By Application, By Region

Major Regions Covered

North America, Europe, Asia Pacific, Latin America, and the Middle East & Africa

Purchase Options

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logoIndustry Growth Factors

The commercial availability of a variety of thermal interface materials in a variety of forms, along with expanding uses in the electronic sector, is expected to boost penetration in the coming years. Thermal interface materials are used to conduct heat across two hard surfaces and are particularly useful when sophisticated electrical gadgets are in high demand. Thermal interfaces are well-known for providing effective heat management solutions, which are necessary for enhancing the overall performance and longevity of a system.

Because of its thermal conductivity, the product is expected to see considerable gains, which will assist to extend the life and efficiency of the electronic device or equipment where it is used. Conductive materials, such as metals, metal oxides, or silicone, are commonly used to create the product.

Consumer behavior for electronic gadgets such as cell phones, tablets, and video games has not been affected by the post-pandemic situation. Rather, in recent years, under the recession, consumer durables sales have been falling as well. Furthermore, due to an increasing need for pharmaceuticals and medical equipment, demand for pharmaceutical and medical gear, as well as lab equipment has grown.

Thermal Interface Materials Market

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logoSegmentation Analysis

The global thermal interface materials market is segregated based on type, product type, application, and region. Based on type the market is bifurcated into polyimide, epoxy, silicone, and others. The silicone segment dominated in 2020 and is expected to continue its dominance in the forecast period. This can be attributed to its outstanding characteristics such as resistance to chemical attack, stability to mechanical stress, shock & vibration resistance, and temperature variation stability. Based on the product type the market is bifurcated into tapes & films, metal-based TIMs, greases & adhesives, phase change materials, gap fillers, and others. The greases & adhesives category dominated the product type segmentation in 2020 and is expected to dominate the segment in the upcoming years. This can be attributed to its growing use in several applications such as power conversion equipment, transmission & engine control modules, PCs, memory modules, server CPUs, and mobile phones among others. Based on application the market is divided into telecom, medical devices, automotive electronics, computers, consumer durables, industrial machinery, and others. The computers category dominated the application segmentation in 2020 and is expected to dominate the segment in the upcoming years. This can be attributed to the growing use of TIMs in GPUs and CPSs of computers.

logo Regional Analysis

Asia Pacific region dominated the market in 2020 with a market share of more than 35% and is anticipated to continue its dominance in the upcoming years. This is due to the existence of a big manufacturing zone in the area. Government policies, GST reductions, corporate tax reductions, changing lifestyles, consumer health awareness, and growing family incomes, in addition to the industrial base, have the potential to accelerate industry growth in this region. As more trucks and vans are utilized to deliver essentials across the area, sales in the automotive sector can only be achieved through vehicle refurbishing or repair. However, the government's continued focus on healthcare and the automotive sector, as well as its encouragement of FDI from Asian manufacturers, might help the business recover in the projected term. Despite Europe being a key market for the automobile sector and medical device production, the product is expected to lose income over time. This is owing to the fact that, as a result of the current pandemic epidemic, manufacturing operations have come to a halt due to a collapsed supply and demand for cars.

logo Competitive Players

Some main participants of the global thermal interface materials market are

  • The 3M Company
  • Parker Hannifin Corporation
  • Laird Technologies
  • Indium Corporation
  • Zalma Tech Co. Ltd.
  • Schlegel Electronic Materials Inc.
  • Universal Science
  • Master Bond Inc.
  • Electrolube Limited
  • Fuji Polymer Industries Co. Ltd.
  • AIM Specialty Materials
  • DK Thermal
  • GrafTech International Ltd.
  • AOS Thermal Compounds LLC
  • Shin-Etsu Chemical Co. Ltd.
  • Semikron
  • RBC Industries Inc.
  • LORD Corporation
  • Aremco Products Inc.
  • Timtronics
  • Wakefield-Vette Inc.
  • Momentive Performance Materials
  • Dow Corning Corporation
  • Henkel AG & Co. KGaA
  • Honeywell International Inc.

logoGlobal Thermal Interface Materials Market – By Type

  • Silicone
  • Epoxy
  • Polyimide
  • Others

logoGlobal Thermal Interface Materials Market – By Product Type

  • Greases & Adhesives
  • Tapes & Films
  • Gap Fillers
  • Metal-Based TIMs
  • Phase Change Materials
  • Others

logoGlobal Thermal Interface Materials Market – By Application

  • Computers
  • Telecom
  • Consumer Durables
  • Medical Devices
  • Industrial Machinery
  • Automotive Electronics
  • Others

logoGlobal Thermal Interface Materials Market – By Region

  • North America
    • U.S.
    • Canada
  • Europe
    • France
    • The UK
    • Spain
    • Germany
    • Italy
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Southeast Asia
    • Rest of Asia Pacific
  • Latin America
    • Brazil
    • Mexico
    • Rest of Latin America
  • Middle East & Africa
    • GCC Countries
    • South Africa
    • Rest of Middle East & Africa

Industry Major Market Players

  • The 3M Company
  • Parker Hannifin Corporation
  • Laird Technologies
  • Indium Corporation
  • Zalma Tech Co. Ltd.
  • Schlegel Electronic Materials Inc.
  • Universal Science
  • Master Bond Inc.
  • Electrolube Limited
  • Fuji Polymer Industries Co. Ltd.
  • AIM Specialty Materials
  • DK Thermal
  • GrafTech International Ltd.
  • AOS Thermal Compounds LLC
  • Shin-Etsu Chemical Co. Ltd.
  • Semikron
  • RBC Industries Inc.
  • LORD Corporation
  • Aremco Products Inc.
  • Timtronics
  • Wakefield-Vette Inc.
  • Momentive Performance Materials
  • Dow Corning Corporation
  • Henkel AG & Co. KGaA
  • Honeywell International Inc.

Frequently Asked Questions

Thermal interface materials are materials that are used to disperse heat from electronic devices and enhance heat transmission.
The commercial availability of a variety of thermal interface materials in a variety of forms, along with expanding uses in the electronic sector, is expected to boost penetration in the coming years.
The global thermal interface materials market was registered at around USD 2.8 Billion in 2020 and is expected to generate approximately USD 5.1 Billion in revenue by the end of 2026, with a CAGR of approximately 10.4% between 2021 and 2026.
The CAGR value of Hot Sauce market is expected to be around 10.4% during 2021-2026.
The global Hot Sauce market is expected to witness the highest growth in "Asia Pacific".
Some main participants of the global thermal interface materials market are The 3M Company, Parker Hannifin Corporation, Laird Technologies, Indium Corporation, Zalma Tech Co. Ltd., Schlegel Electronic Materials, Inc., Universal Science, Master Bond Inc., Electrolube Limited, Fuji Polymer Industries Co., Ltd., AIM Specialty Materials, DK Thermal, GrafTech International Ltd., AOS Thermal Compounds LLC, Shin-Etsu Chemical Co. Ltd., Semikron, RBC Industries, Inc., LORD Corporation, Aremco Products Inc., Timtronics, Wakefield-Vette, Inc., Momentive Performance Materials, Dow Corning Corporation, Henkel AG & Co. KGaA, and Honeywell International Inc. amongst others.